JPS5815945B2 - リ−ドフレ−ムハンドウタイソウチ - Google Patents

リ−ドフレ−ムハンドウタイソウチ

Info

Publication number
JPS5815945B2
JPS5815945B2 JP49132326A JP13232674A JPS5815945B2 JP S5815945 B2 JPS5815945 B2 JP S5815945B2 JP 49132326 A JP49132326 A JP 49132326A JP 13232674 A JP13232674 A JP 13232674A JP S5815945 B2 JPS5815945 B2 JP S5815945B2
Authority
JP
Japan
Prior art keywords
lead
insulating film
pellet
lead pieces
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49132326A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5158066A (en]
Inventor
佐藤奨
春日寿夫
渡辺章
日野雅夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49132326A priority Critical patent/JPS5815945B2/ja
Publication of JPS5158066A publication Critical patent/JPS5158066A/ja
Publication of JPS5815945B2 publication Critical patent/JPS5815945B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP49132326A 1974-11-15 1974-11-15 リ−ドフレ−ムハンドウタイソウチ Expired JPS5815945B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49132326A JPS5815945B2 (ja) 1974-11-15 1974-11-15 リ−ドフレ−ムハンドウタイソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49132326A JPS5815945B2 (ja) 1974-11-15 1974-11-15 リ−ドフレ−ムハンドウタイソウチ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP18330981A Division JPS5921175B2 (ja) 1981-11-16 1981-11-16 リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS5158066A JPS5158066A (en]) 1976-05-21
JPS5815945B2 true JPS5815945B2 (ja) 1983-03-28

Family

ID=15078692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49132326A Expired JPS5815945B2 (ja) 1974-11-15 1974-11-15 リ−ドフレ−ムハンドウタイソウチ

Country Status (1)

Country Link
JP (1) JPS5815945B2 (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732596Y2 (en]) * 1977-08-24 1982-07-17
JPS60229344A (ja) * 1984-04-27 1985-11-14 Nec Corp ボンデイング方法
JPS6190453A (ja) * 1984-10-09 1986-05-08 Nec Corp フイルムキャリヤーテープ
JPS63132432U (en]) * 1987-02-20 1988-08-30
JPH03106740U (en]) * 1989-12-01 1991-11-05

Also Published As

Publication number Publication date
JPS5158066A (en]) 1976-05-21

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